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WebDec 12, 2014 · Since the introduction of Cu/low-k as the interconnect material, the chip-package interaction (CPI) has become a critical reliability challenge for flip chip packages. Revision of underfill material must be considered, which compromises the life of flip chip interconnect by releasing the stresses transferred to the silicon devices from the solder … WebTI’s broad packaging portfolio supports thousands of diversified products, packaging configurations and technologies. These packages include traditional ceramic and leaded … scheduleatfixedrate和schedulewithfixeddelay

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